Semiconductor light emitting device and method for manufacturing semiconductor light emitting device

ABSTRACT

According to one embodiment, a semiconductor light emitting device includes an n-type semiconductor layer, a p-type semiconductor layer, and a light emitting layer. The p-type semiconductor layer includes a first p-side layer, a second p-side layer, and a third p-side layer. A concentration profile of Mg of a p-side region includes a first portion, a second portion, a third portion, a fourth portion, a fifth portion, a sixth portion and a seventh portion. The p-side region includes the light emitting layer, the second p-side layer, and the third p-side layer. A Mg concentration of the sixth portion is not less than 1×10 20  cm −3  and not more than 3×10 20  cm −3 . The Al concentration is 1/100 of the maximum value at a second position. A Mg concentration at the second position is not less than 2×10 18  cm −3 .

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. application Ser. No.14/093,925, filed Dec. 2, 2013, which claims the benefit of priorityfrom Japanese Patent Application No. 2012-286131, filed on Dec. 27,2012; the entire contents of each of which are incorporated herein byreference.

FIELD

Embodiments described herein relate generally to a semiconductor lightemitting device and a method for manufacturing the same semiconductorlight emitting device.

BACKGROUND

Semiconductor light emitting devices such as light emitting diodes,laser diodes, etc., that use a nitride semiconductor are beingdeveloped. There are cases where the drive voltage of the semiconductorlight emitting device increases as the density of the current that issupplied increases.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a graph showing the semiconductor light emitting deviceaccording to the first embodiment;

FIG. 2 is a schematic cross-sectional view showing the semiconductorlight emitting device according to the first embodiment;

FIG. 3 is a schematic cross-sectional view showing a portion of thesemiconductor light emitting device according to the first embodiment;

FIG. 4 is a graph showing the semiconductor light emitting devices ofthe reference examples;

FIG. 5 is a graph showing the semiconductor light emitting devices ofthe reference examples;

FIG. 6 is another graph showing the semiconductor light emitting deviceaccording to the first embodiment;

FIG. 7 is other graph showing the semiconductor light emitting device ofthe reference example;

FIG. 8 is other graph showing the semiconductor light emitting device ofthe reference example;

FIG. 9 is a graph showing another semiconductor light emitting deviceaccording to the first embodiment;

FIG. 10 is a graph showing a semiconductor light emitting device of areference example; and

FIG. 11 is a flowchart showing the method for manufacturing thesemiconductor light emitting device according to the second embodiment.

DETAILED DESCRIPTION

In general, according to one embodiment, a semiconductor light emittingdevice includes an n-type semiconductor layer, a p-type semiconductorlayer, and a light emitting layer. The n-type semiconductor layerincludes a nitride semiconductor. The p-type semiconductor layerincludes a first p-side layer, a second p-side layer ofAl_(x2)Ga_(1-x2)N (0.05≦x2≦0.2), and a third p-side layer ofAl_(x3)Ga_(1-x3)N (0≦x3≦x2). The first p-side layer includes a nitridesemiconductor including Mg. The second p-side layer is provided betweenthe first p-side layer and the n-type semiconductor layer and includingMg. The third p-side layer is provided between the first p-side layerand the second p-side layer and including Mg. The light emitting layeris provided between the n-type semiconductor layer and the second p-sidelayer. The light emitting layer includes a nitride semiconductor. Aconcentration profile of Mg of a p-side region includes a first portion,a second portion, a third portion, a fourth portion, a fifth portion, asixth portion and a seventh portion. The p-side region includes thelight emitting layer, the second p-side layer, and the third p-sidelayer. The second portion is provided between the first portion and thefirst p-side layer. The third portion is provided between the firstportion and the second portion. A Mg concentration of the third portionincreases at a first increase rate along a first direction from then-type semiconductor layer toward the first p-side layer. The fourthportion is provided between the third portion and the second portion.The Mg concentration of the fourth portion increases at a secondincrease rate along the first direction. The fifth portion is providedbetween the third portion and the fourth portion. A Mg concentration ofthe fifth portion increases at a third increase rate along the firstdirection. The third increase rate is lower than the first increase rateand lower than the second increase rate. The sixth portion is providedbetween the fourth portion and the second portion. A Mg concentration ofthe sixth portion is not less than 1×10²⁰ cm⁻³ and not more than 3×10²⁰cm⁻³ and is higher than the concentrations of Mg of the first portion,the second portion, the third portion, the fourth portion, and the fifthportion. The seventh portion is provided between the sixth portion andthe second portion. A Mg concentration of the seventh portion decreasesalong the first direction. The Al concentration is 1/100 of the maximumvalue at a second position arranged with the first position along thefirst direction in a region between the first position and a positioncorresponding to the first portion. A Mg concentration at the secondposition is not less than 2×10¹⁸ cm⁻³.

In general, according to one embodiment, a method for manufacturing asemiconductor light emitting device includes forming a light emittinglayer including a nitride semiconductor on an n-type semiconductor layerincluding a nitride semiconductor, forming a first film ofAl_(x)Ga_(1-x)N (0.05≦x≦0.2) on the light emitting layer, forming asecond film including a nitride semiconductor including Mg on the firstfilm, and

forming a third film including a nitride semiconductor including Mg onthe second film. The first film includes Mg. The forming of the firstfilm includes alternately and multiply repeating a first process and asecond process. The first process is supplying a group V source-materialgas, a gas including Ga, a gas including Al, and a gas including Mg. Thesecond process is supplying the group V source-material gas withoutsupplying the gas including Ga, the gas including Al, and the gasincluding Mg. A maximum value of a concentration of Mg in a p-sideregion including the light emitting layer, the first film, and thesecond film is not less than 1×10²⁰ cm⁻³ and not more than 3×10²⁰ cm⁻³.An Al concentration in the p-side region has a maximum value at a firstposition. The Al concentration is 1/100 of the maximum value at a secondposition arranged with the first position along a first direction fromthe light emitting layer toward the first film in a region between thefirst position and a position corresponding to the light emitting layer.A Mg concentration at the second position is not less than 2×10¹⁸ cm⁻³.

Embodiments of the invention will now be described with reference to thedrawings.

The drawings are schematic or conceptual; and the relationships betweenthe thicknesses and widths of portions, the proportions of sizes betweenportions, etc., are not necessarily the same as the actual valuesthereof. Further, the dimensions and/or the proportions may beillustrated differently between the drawings, even for identicalportions.

In the drawings and the specification of the application, componentssimilar to those described in regard to a drawing thereinabove aremarked with like reference numerals, and a detailed description isomitted as appropriate.

First Embodiment

The embodiment relates to a semiconductor light emitting device. Thesemiconductor light emitting device according to the embodimentincludes, for example, a light emitting diode (LED), a laser diode (LD),etc.

FIG. 1 is a graph showing the semiconductor light emitting deviceaccording to the first embodiment.

FIG. 2 is a schematic cross-sectional view showing the semiconductorlight emitting device according to the first embodiment.

As shown in FIG. 2, the semiconductor light emitting device 110according to the embodiment includes an n-type semiconductor layer 10, ap-type semiconductor layer 20, and a light emitting layer 30. Theselayers are included in a stacked structural body 90.

FIG. 1 shows a composition profile of the semiconductor light emittingdevice 110. The composition profile is described below.

The n-type semiconductor layer 10 includes a nitride semiconductor. Then-type semiconductor layer 10 has a first major surface 10 a and asecond major surface 10 b. The first major surface 10 a opposes thelight emitting layer 30 (an intermediate layer 40). The second majorsurface 10 b is on the side opposite to the first major surface 10 a.

The n-type semiconductor layer 10 includes, for example, an n-type GaNlayer doped with silicon (Si). The concentration of Si is, for example,about 8×10¹⁸ (cm⁻³, i.e., atoms/cm³). The thickness of the n-typesemiconductor layer 10 is, for example, not less than 2 micrometers (μm)and not more than 8 μm, e.g., 5 μm. At least a portion of the n-typesemiconductor layer 10 functions as, for example, an n-type clad layer.

A direction from the n-type semiconductor layer 10 toward the p-typesemiconductor layer 20 is taken as the stacking direction (a Z-axisdirection). The first major surface 10 a and the second major surface 10b of the n-type semiconductor layer 10 are substantially perpendicularto the Z-axis direction.

In the specification, being “stacked” includes not only the state ofoverlapping in contact with each other but also the state of overlappingwith another layer inserted therebetween.

The p-type semiconductor layer 20 includes a first p-side layer 21, asecond p-side layer 22, and a third p-side layer 23. The second p-sidelayer 22 is provided between the first p-side layer 21 and the n-typesemiconductor layer 10. The third p-side layer 23 is disposed betweenthe first p-side layer 21 and the second p-side layer 22.

The first p-side layer 21 includes a nitride semiconductor including Mg.The first p-side layer 21 includes, for example, a p-type GaN layer. Thefirst p-side layer is, for example, a p-type contact layer. The Mgconcentration of the first p-side layer 21 is higher than the Mgconcentration of the third p-side layer 23. The Mg concentration of thefirst p-side layer 21 may be higher than the Mg concentration of thesecond p-side layer 22. The Mg concentration of the first p-side layer21 is, for example, not less than 1×10²⁰ cm⁻³ and not more than 3×10²¹cm⁻³. The thickness of the first p-side layer 21 is, for example, notless than 5 nanometers (nm) and not more than 20 nm, e.g., about 10 nm.

The second p-side layer 22 includes Mg. For example, anAl_(x2)Ga_(1-x2)N (0.05≦x2≦0.2) layer is used as the second p-side layer22. The second p-side layer 22 functions as, for example, an electronblocking layer to trap electrons in the light emitting layer 30. Thethickness of the second p-side layer 22 is, for example, not less than 5nm and not more than 20 nm, e.g., about 10 nm.

The third p-side layer 23 includes Mg. For example, an Al_(x3)Ga_(1-x3)N(0≦x3<x2) layer is used as the third p-side layer 23. For example, ap-type GaN layer is used as the third p-side layer 23. The Mgconcentration of the third p-side layer 23 is not less than 1×10¹⁹ cm⁻³and not more than 3×10¹⁹ cm⁻³. The Mg concentration is substantiallyconstant inside the third p-side layer 23. The Mg concentration isdescribed below. The third p-side layer 23 functions as, for example, ap-side clad layer. The thickness of the third p-side layer 23 is, forexample, not less than 20 nm and not more than 150 nm, e.g., about 80nm.

A capping layer 25 may be further provided between the light emittinglayer 30 and the p-type semiconductor layer 20. For example, an undopedAl_(x5)Ga_(1-x5)N (0.003≦x5≦0.03) layer may be used as the capping layer25. The Mg concentration of the capping layer 25 is lower than the Mgconcentration of the p-type semiconductor layer 20 (e.g., the secondp-side layer 22). The thickness of the capping layer 25 is, for example,not less than 1 nm and not more than 5 nm.

In the case where the capping layer 25 is formed, the capping layer 25is observed in some cases and is not observed distinctly in some casesby, for example, electron micrograph observation, etc. For example,there are cases where Mg diffuses from the p-type semiconductor layer 20into the capping layer 25; and the capping layer 25 is observed, forexample, as a portion of the second p-side layer 22.

In the example, the semiconductor light emitting device 110 furtherincludes the intermediate layer 40, a foundation layer 60, a substrate50, a first electrode 70, and a second electrode 80. The intermediatelayer 40 and the foundation layer 60 are included in the stackedstructural body 90.

The foundation layer 60 is provided on the substrate 50. The n-typesemiconductor layer 10 is provided on the foundation layer 60. Theintermediate layer 40 is provided on the n-type semiconductor layer 10.The light emitting layer 30, the capping layer 25, and the p-typesemiconductor layer 20 are provided in this order on the intermediatelayer 40.

For example, a sapphire substrate (e.g., a c-plane sapphire substrate)is used as the substrate 50. The substrate 50 may be, for example, asubstrate of GaN, SiC, ZnO, Si, etc. The plane orientation of thesubstrate 50 is arbitrary. The substrate 50 may be removed.

For example, an undoped GaN layer is used as the foundation layer 60.The thickness of the foundation layer 60 is, for example, not less thanabout 1 μm and not more than about 5 μm, e.g., about 3 μm. A bufferlayer may be further provided between the substrate 50 and thefoundation layer 60. The thickness of the buffer layer is, for example,not less than 5 nm and not more than 30 nm, e.g., about 20 nm.

The first electrode 70 is electrically connected to the n-typesemiconductor layer 10. The second electrode 80 is electricallyconnected to the p-type semiconductor layer 20.

In the example, a portion of the n-type semiconductor layer 10 on thefirst major surface 10 a side is exposed. The first electrode 70 iselectrically connected to the n-type semiconductor layer 10 at theexposed portion of the n-type semiconductor layer 10. The firstelectrode 70 is disposed on, for example, the first major surface 10 aside of the n-type semiconductor layer 10. The second electrode 80 isprovided on, for example, the front surface of the p-type semiconductorlayer 20.

In the specification of the application, the state of being “providedon” includes not only the state of being provided in direct contact butalso the state in which another layer is inserted therebetween.

The first electrode 70 includes, for example, a stacked film of a Tifilm/Pt film/Au film. The second electrode 80 includes, for example, astacked film of a Ni film/Au film.

A voltage is applied between the first electrode 70 and the secondelectrode 80. A current is supplied to the light emitting layer 30 viathe n-type semiconductor layer 10 and the p-type semiconductor layer 20.Light is emitted from the light emitting layer 30. The peak wavelengthof the light (the emitted light) emitted from the light emitting layer30 is, for example, not less than 400 nm and not more than 650 nm. Thepeak wavelength of the light (the emitted light) emitted from the lightemitting layer 30 is, for example, not less than 430 nm and not morethan 460 nm.

FIG. 3 is a schematic cross-sectional view showing a portion of thesemiconductor light emitting device according to the first embodiment.FIG. 3 shows an example of the configuration of the light emitting layer30 and the intermediate layer 40.

The light emitting layer 30 has, for example, a multiple quantum well(MQW) configuration. In such a case, the light emitting layer 30includes three or more barrier layers 31, and well layers 32 providedrespectively in the spaces between the barrier layers 31. For example,the multiple barrier layers 31 and the multiple well layers 32 arestacked alternately along the Z axis. Or, the light emitting layer 30may have, for example, a single quantum well (SQW) configuration. Insuch a case, the light emitting layer 30 includes two barrier layers 31,and a well layer 32 provided between the barrier layers 31.

The light emitting layer 30 includes, for example, n+1 barrier layers 31and n well layers 32 (n being an integer not less than 2). The (n+1)thbarrier layer BL(n+1) is disposed between the nth barrier layer BLn andthe p-type semiconductor layer 20 (the second p-side layer 22). The nthwell layer WLn is disposed between the (n−1)th well layer WL(n−1) andthe p-type semiconductor layer 20 (the second p-side layer 22). Thefirst barrier layer BL1 is provided between the n-type semiconductorlayer 10 and the first well layer WL1. The nth well layer WLn isprovided between the nth barrier layer BLn and the (n+1)th barrier layerBL(n+1). The (n+1)th barrier layer BL(n+1) is provided between the nthwell layer WLn and the p-type semiconductor layer 20 (the second p-sidelayer 22).

In the example, the barrier layer 31 contacts the p-type semiconductorlayer 20 (the second p-side layer 22). The well layer 32 may contact thep-type semiconductor layer 20 (the second p-side layer 22).

The barrier layer 31 includes In_(y1)Ga_(1-y1)N (0≦y1<1). The well layer32 includes In_(y2)Ga_(1-y2)N (0<y2≦1 and y1<y2). In other words, thewell layer 32 includes In. In the case where the barrier layer 31includes In, the In concentration of the barrier layer 31 is lower thanthe In concentration of the well layer 32. Or, the barrier layer 31substantially does not include In. The bandgap energy of the barrierlayer 31 is greater than the bandgap energy of the well layer 32. The Incomposition ratio y2 of the well layer 32 is, for example, not less than0.1 and not more than 0.15, e.g., 0.14.

The intermediate layer 40 includes multiple first layers 41 and multiplesecond layers 42. The multiple first layers 41 and the multiple secondlayers 42 are stacked alternately in the Z-axis direction.

The first layer 41 includes, for example, an n-type GaN layer doped withSi. The Si concentration of the first layer 41 is, for example, about2×10¹⁸ cm⁻³. The second layer 42 includes, for example, an undoped InGaNlayer. The second layer 42 includes, for example, an undopedIn_(y3)Ga_(1-y3)N (0<y3<0.1) layer. The thickness of the first layer 41is, for example, not less than 2 nm and not more than 6 nm, e.g., about3 nm. The thickness of the second layer 42 is, for example, not lessthan 0.5 nm and not more than 2 nm, e.g., about 1 nm. The intermediatelayer 40 has a superlattice structure. In the example, the number of thesecond layers 42 is, for example, not less than 20 layers, e.g., 30layers.

FIG. 1 shows the profile of the Mg concentration and the profile of theAl concentration of the semiconductor light emitting device 110. FIG. 1shows results of secondary ion mass spectrometry (SIMS) of thesemiconductor light emitting device 110.

In FIG. 1, the horizontal axis is a position dz in the depth direction(the Z-axis direction). The position where the position dz is 0 nm isthe upper surface of the first p-side layer 21 (the surface on the sideopposite to the light emitting layer 30). The vertical axis on the leftside is the concentration of Mg (CMg having units of /cm⁻³). Thevertical axis on the right side is the Al concentration (CAl havingarbitrary units).

As shown in FIG. 1, the semiconductor light emitting device 110 includesa p-side region R1. The p-side region R1 includes the light emittinglayer 30, the second p-side layer 22, and the third p-side layer 23. Theconcentration profile of Mg in the p-side region R1 includes first toseventh portions P01 to P07. The second portion P02 is provided betweenthe first portion P01 and the first p-side layer 21. The third portionP03 is provided between the first portion P01 and the second portionP02. The fourth portion P04 is provided between the third portion P03and the second portion P02. The fifth portion P05 is provided betweenthe third portion P03 and the fourth portion P04. The sixth portion P06is provided between the fourth portion P04 and the second portion P02.The seventh portion P07 is provided between the sixth portion P06 andthe second portion P02.

The Mg concentration of the first portion P01 is low and is, forexample, not less than 1×10¹⁶ cm⁻³ and not more than 5×10¹⁷ cm⁻³. Atleast a portion of the first portion P01 corresponds to, for example,the light emitting layer 30.

The Mg concentration of the second portion P02 is, for example, not lessthan 1×10¹⁹ cm⁻³ and not more than 5×10¹⁹ cm⁻³ and is higher than the Mgconcentration of the first portion P01. At least a portion of the secondportion P02 corresponds to the third p-side layer 23.

The Mg concentration of the first p-side layer 21 is, for example, notless than 3×10²⁰ cm⁻³ and not more than 3×10²¹ cm⁻³. The Mgconcentration of the first p-side layer 21 is higher than the Mgconcentration of the second portion P02.

The sixth portion P06 has the highest Mg concentration in the p-sideregion R1 that includes the light emitting layer 30, the second p-sidelayer 22, and the third p-side layer 23. In the p-side region R1, theportion where the Mg concentration has a peak corresponds to the sixthportion P06. The sixth portion P06 corresponds to at least a portion ofthe second p-side layer 22.

The direction from the n-type semiconductor layer 10 toward the firstp-side layer 21 is taken as a first direction D1. The first direction D1is a direction along the Z-axis direction. The first direction D1corresponds to the upward direction in FIG. 2.

The Mg concentration of the third portion P03 increases along the firstdirection D1. The Mg concentration of the third portion P03 increases ata first increase rate.

The Mg concentration of the fourth portion P04 increases along the firstdirection D1. The Mg concentration of the fourth portion P04 increasesat a second increase rate.

The Mg concentration of the fifth portion P05 increases along the firstdirection D1. The Mg concentration of the fifth portion P05 increases ata third increase rate. The third increase rate is lower than the firstincrease rate. The third increase rate is lower than the second increaserate.

The Mg concentration of the sixth portion P06 is higher than theconcentrations of Mg of the first portion P01, the second portion P02,the third portion P03, the fourth portion P04, and the fifth portionP05. The Mg concentration of the sixth portion P06 is not less than1×10²⁰ cm⁻³ and not more than 3×10²⁰ cm⁻³.

The Mg concentration of the seventh portion P07 decreases along thefirst direction D1.

The Mg concentration of the third portion P03 increases along the firstdirection D1 (at the first increase rate). Then, the increase rate ofthe fifth portion P05 is lower (the third increase rate). Further, theincrease rate of the Mg concentration of the fourth portion P04 becomeshigh again (the second increase rate). Then, the Mg concentration of thesixth portion P06 is the highest Mg concentration. Subsequently, the Mgconcentration of the seventh portion P07 is lower.

On the other hand, as shown in FIG. 1, the Al concentration increasesabruptly along the first direction D1 at the vicinity of the interfacebetween the light emitting layer 30 and the second p-side layer 22. Forexample, the Al concentration of the light emitting layer 30 is not lessthan 1 and not more than 20 (no units). For example, the Alconcentration of the first p-side layer 21 is not less than 1 and notmore than 10. In at least a portion of the third p-side layer 23 aswell, the Al concentration is not less than 1 and not more than 10. TheAl concentration has a maximum value at the vicinity of the secondp-side layer 22. In the example, the maximum value of the Alconcentration is about 2×10⁴.

A first position Z01 and a second position Z02 are set in the p-sideregion R1 to describe the profile of the Al concentration.

The first position Z01 is a position along the first direction D1. Thesecond position Z02 also is a position along the first direction D1. Thesecond position Z02 is provided in a region between the first positionZ01 and a position (a position along the first direction D1)corresponding to the first portion P01. The second position Z02 isarranged with the first position Z01 along the first direction D1. Inthe example, the first position Z01 is disposed inside the second p-sidelayer 22.

The Al concentration at the first position Z01 is taken as a first Alvalue A01. The first Al value A01 is the maximum value of the Alconcentration in the p-side region R1.

The Al concentration at the second position Z02 is taken as a second Alvalue A02. The second Al value A02 is 1/100 of the first Al value A01which is the maximum value.

The Al concentration decreases abruptly along the first direction D1between the first position Z01 and the position of the first p-sidelayer 21.

In the example, the light emitting layer 30 substantially does notinclude Al. The third p-side layer 23 substantially does not include Al.The second p-side layer 22 includes Al.

The Mg concentration at the second position Z02 is taken as a first Mgvalue M01.

In the embodiment, the first Mg value M01 is, for example, not less than2×10¹⁸ cm⁻³. It is favorable for the first Mg value M01 to be, forexample, not more than 1.2×10¹⁹ cm⁻³. In the example shown in FIG. 1,the first Mg value M01 is 2.1×10¹⁸ cm⁻³.

In the semiconductor light emitting device 110 as shown in FIG. 1, theMg concentration increases to follow the increase of the Alconcentration. The first Mg value M01 at the second position Z02 is notless than 2×10¹⁸ cm⁻³. Thereby, the drive voltage can be lower. Thedrive voltage is described below.

As described above, even in the case where the capping layer 25 isformed, there are cases where the capping layer 25 is not observeddistinctly. Therefore, the capping layer 25 is not shown in FIG. 1.

An example of a method for manufacturing the semiconductor lightemitting device 110 will now be described. The profiles of the Mgconcentration and the Al concentration shown in FIG. 1 are obtained by,for example, the manufacturing method described below.

For example, organic cleaning and acid cleaning of the substrate 50 areperformed. After the cleaning, crystal growth is performed on thesubstrate 50 to form, in order, a buffer layer, the foundation layer 60,the n-type semiconductor layer 10, the intermediate layer 40, the lightemitting layer 30, and the p-type semiconductor layer 20. Thereby, thestacked structural body 90 is formed on the substrate 50. The bufferlayer is formed if necessary.

For example, MOCVD (Metal Organic Chemical Vapor Deposition) is used toform the stacked structural body 90. Hydride vapor phase epitaxy (HVPE),molecular beam epitaxy (MBE), etc., may be used to form these layers. Anexample in which the stacked structural body 90 is formed by MOCVD willnow be described.

After cleaning, the substrate 50 is placed inside the reaction chamberof a MOCVD apparatus. The substrate 50 includes c-plane sapphire. Thetemperature of the substrate 50 is increased to 1160° C. byhigh-frequency heating in an atmospheric pressure mixed gas atmosphereof nitrogen (N₂) gas and hydrogen (H₂) gas. Thereby, gas phase etchingof the front surface of the substrate 50 is performed. The native oxidefilm that was formed on the front surface of the substrate 50 isremoved.

The temperature of the substrate 50 is reduced to 530° C. A buffer layer(a low-temperature buffer layer) is formed on the substrate 50. Acarrier gas and a process gas are supplied to form the buffer layer. Forexample, a gas mixture of N₂ gas and H₂ gas is used as the carrier gas.In the example, a group V source-material gas, a gas including Ga, and agas including Al are supplied as the process gas. For example, anammonia (NH₃) gas is used as the group V source-material gas. Forexample, tri-methyl gallium (TMG) is used as the gas including Ga. Forexample, tri-ethyl gallium (TEG) may be used as the gas including Ga.For example, tri-methyl aluminum (TMA) is used as the gas including Al.

For example, an undoped GaN layer is formed as the foundation layer 60.The supply of TMG and TMA is stopped while continuing the supply of NH₃.The temperature is increased to 1150° C. TMG is supplied again whilemaintaining the temperature at 1150° C. Thereby, the foundation layer 60is formed. The thickness of the foundation layer 60 is, for example,about 3 μm.

For example, an n-type GaN layer is formed as the n-type semiconductorlayer 10. Further, a gas including Si is supplied without changing theprocess gas. For example, silane (SiH₄) gas is used as the gas includingSi. The temperature of the substrate 50 is 1150° C. The Si concentrationof the n-type semiconductor layer 10 is, for example, 8×10¹⁸/cm⁻³. Thethickness of the n-type semiconductor layer 10 is, for example, about 5μm.

The supply of TMG and SiH₄ gas is stopped while continuing the supply ofNH₃. The temperature of the substrate 50 is reduced to 800° C. andmaintained at 800° C.

For example, an n-type GaN layer is formed as the first layer 41 of theintermediate layer 40. The temperature of the substrate 50 is 800° C. inthe formation of the first layer 41. N₂ gas is used as the carrier gas.NH₃, TMG, and SiH₄ gas are used as the process gas. The Si concentrationof the first layer 41 is, for example, about 2×10¹⁸/cm⁻³. The thicknessof the first layer 41 is, for example, about 3 nm.

For example, undoped In_(y3)Ga_(1-y3)N (0<y3<0.1) is formed as thesecond layer 42 of the intermediate layer 40. In the formation of thesecond layer 42, the supply of SiH₄ gas is stopped; and a gas includingIn is supplied. For example, tri-methyl indium (TMI) is used as the gasincluding In. The temperature of the substrate 50 is 800° C. y3 of theundoped In_(y3)Ga_(1-y3)N layer (the second layer 42) is, for example,0.08. The thickness of the second layer 42 is, for example, 1 nm.

The formation of the first layer 41 recited above and the formation ofthe second layer 42 recited above are multiply repeated. In other words,the supply of SiH₄ gas and the supply of TMI are alternately repeated.The number of repetitions is, for example, thirty periods. Thereby, theintermediate layer 40 having a superlattice structure is formed.

The light emitting layer 30 is formed. First, for example, a GaN layeris formed as the barrier layer 31. N₂ gas is used as the carrier gas toform the barrier layer 31. NH₃ and TMG are used as the process gas. Thetemperature of the substrate 50 is 830° C. The thickness of the barrierlayer 31 is, for example, about 5 nm.

For example, an In_(y2)Ga_(1-y2)N layer (0<y2<1) is formed as the welllayer 32. TMI also is supplied to form the well layer 32. Thetemperature of the substrate 50 is 830° C. y2 of the In_(y2)Ga_(1-y2)Nlayer (the well layer 32) is, for example, 0.14. The thickness of thewell layer 32 is, for example, about 3 nm.

For example, the formation of the barrier layer 31 recited above and theformation of the well layer 32 recited above are multiply repeated. Inother words, TMI is supplied intermittently. The number of repetitionsis, for example, eight periods.

The final barrier layer 31 (GaN layer) is formed on the final well layer32. The thickness of the GaN layer (the final barrier layer 31) is, forexample, 5 nm. Here, the barrier layer 31 is formed as the uppermostportion of the light emitting layer 30. The well layer 32 may be formedas the uppermost portion of the light emitting layer 30.

For example, an undoped AlGaN layer is formed as the capping layer 25 onthe light emitting layer 30 in the example. In the formation of thecapping layer 25, TMA is supplied; and the temperature of the substrate50 is 830° C. The thickness of the AlGaN layer used to form the cappinglayer 25 is, for example, 5 nm directly after formation.

Then, the supply of TMG is stopped while continuing the supply of NH₃.The temperature of the substrate 50 is increased to 1030° C. in a N₂ gasatmosphere. The temperature is maintained at 1030° C.

A p-type AlGaN layer is formed as the second p-side layer 22 at thesubstrate temperature of 1030° C. A gas mixture of N₂ gas and H₂ gas areused as the carrier gas to form the second p-side layer 22. A gasincluding NH₃, TMG, TMA, and Mg is supplied as the process gas. Forexample, bis(cyclopentadienyl)magnesium (Cp₂Mg) is used as the gasincluding Mg.

The Mg concentration is 2×10¹⁹ cm⁻³ in the initial formation of thesecond p-side layer 22. The Mg concentration increases inside the secondp-side layer 22 to reach, for example, about 1×10²⁰ cm⁻³. The thicknessof the second p-side layer 22 is about 10 nm.

An example of the method for forming the second p-side layer 22 will nowbe described.

The temperature of the substrate 50 is stabilized at 1030° C. which isthe growth temperature. After the temperature has stabilized, TMG, TMA,and Cp₂Mg are supplied in pulses while supplying the carrier gas and NH₃of the process gas. The supply amount of TMG is, for example, 28micromols/minute (μmol/min); the supply amount of TMA is, for example,1.9 μmol/min; and the supply amount of Cp₂Mg is, for example, 0.25μmol/min. For example, the supply of TMG, TMA, and Cp₂Mg being ON andOFF is repeated for 60 cycles. Thereby, the second p-side layer 22 isformed.

Continuing from the formation of the second p-side layer 22, a p-typeGaN layer is formed as the third p-side layer 23. Namely, after theformation of the second p-side layer 22, the supply of TMA is stoppedwhile continuing the supply of TMG and Cp₂Mg. The temperature of thesubstrate 50 is 1030° C. The Mg concentration of the third p-side layer23 is about 2×10¹⁹ cm⁻³. The thickness of the third p-side layer 23 isabout 80 nm.

Continuing from the formation of the third p-side layer 23, a p-type GaNlayer is formed as the first p-side layer 21. Namely, the supply amountof Cp₂Mg is increased after the formation of the third p-side layer 23.In the formation of the first p-side layer 21, the temperature of thesubstrate 50 is 1030° C. The Mg concentration of the first p-side layer21 is about 1×10²¹ cm⁻³. The thickness of the first p-side layer 21 isabout 10 nm.

Thus, the p-type semiconductor layer 20 is formed.

The supply of TMG and Cp₂Mg is stopped while continuing the supply ofNH₃. In other words, the entire supply of the process gas is stopped.The supply of the carrier gas is continued. The temperature of thesubstrate 50 is allowed to fall naturally. The supply of NH₃ iscontinued until the temperature of the substrate 50 reaches 300° C.

The substrate 50 is extracted from the reaction chamber of the MOCVDapparatus.

A portion of the stacked structural body 90 is removed from the p-typesemiconductor layer 20 side until the n-type semiconductor layer 10 isreached. For example, RIE (Reactive Ion Etching) is used to remove thestacked structural body 90. The first electrode 70 is formed on then-type semiconductor layer 10 that is exposed. The first electrode 70is, for example, a Ti film/Pt film/Au film. The second electrode 80 isformed on the first p-side layer 21. The second electrode 80 is, forexample, a Ni film/Au film.

Thereby, the semiconductor light emitting device 110 is formed. Afterforming the stacked structure film (the stacked structural body 90) onthe substrate 50, the substrate 50 may be removed. A portion of thefoundation layer 60 may be removed when removing the substrate 50.

The Mg concentration profile and the Al concentration profile shown inFIG. 1 are obtained in the semiconductor light emitting device 110 thusmade.

The device size of the semiconductor light emitting device 110 may be asquare having sides of 0.75 mm. For such a device size, the drivevoltage for a current of 350 mA is 3.24 V.

Semiconductor light emitting devices of two reference examples will nowbe described.

Other than the formation process of the second p-side layer 22, themethods for manufacturing the two reference examples are the same as themethod for manufacturing the semiconductor light emitting device 110. Inthe reference examples, the thickness of the second p-side layer 22 isthe same as the semiconductor light emitting device 110. In theformation of the second p-side layer 22 of the reference examples, thetemperature of the substrate 50, the type of the carrier gas, and thetype of the process gas are the same as those of the method formanufacturing the semiconductor light emitting device 110. The formationconditions of the second p-side layer 22 will now be described.

In the formation of the second p-side layer 22 of the first referenceexample, NH₃, TMG, TMA, and Cp₂Mg are supplied simultaneously. TMG, TMA,and Cp₂Mg are supplied not in pulses but continuously. In the firstreference example, the supply amount of TMG, the supply amount of TMA,and the supply amount of Cp₂Mg are the same as those of thesemiconductor light emitting device 110.

In other words, in the formation of the second p-side layer 22 for thesemiconductor light emitting device 110, TMG, TMA, and Cp₂Mg aresupplied in pulses while supplying a constant amount of NH₃; but for thefirst reference example, NH₃, TMG, TMA, and Cp₂Mg are suppliedsimultaneously and continuously.

Other than the supply amount of Cp₂Mg being low, the formation of thesecond p-side layer 22 of the second reference example has the sameformation conditions as the semiconductor light emitting device 110 andthe first reference example. In other words, in the second referenceexample, TMG, TMA, and Cp₂Mg are supplied in pulses while supplying aconstant amount of NH₃. Also, the supply amount of Cp₂Mg is 0.06μmol/min and is less than that of the semiconductor light emittingdevice 110.

The size of the semiconductor light emitting device for the firstreference example and the second reference example is the same as thatof the semiconductor light emitting device 110. In the first referenceexample, the drive voltage for a current of 350 mA is 3.34 V. In thesecond reference example, the drive voltage for a current of 350 mA alsois 3.34 V.

Thus, the drive voltage of the semiconductor light emitting device 110according to the embodiment is 3.24 V; and the drive voltage can belower than those of the reference examples. It is considered that thisis due to the differences of the profile of the Mg concentration and theprofile of the Al concentration between the embodiment and the referenceexamples.

FIG. 4 and FIG. 5 are graphs showing the semiconductor light emittingdevices of the reference examples.

FIG. 4 corresponds to the semiconductor light emitting device 119 a ofthe first reference example. FIG. 5 corresponds to the semiconductorlight emitting device 119 b of the second reference example. Thesedrawings show SIMS analysis results. The horizontal axis is the positiondz in the depth direction (the Z-axis direction). The vertical axis onthe left side is the concentration of Mg (CMg having units of/cm⁻³). Thevertical axis on the right side is the Al concentration (CAl havingarbitrary units).

In the semiconductor light emitting device 119 a of the first referenceexample as shown in FIG. 4, the Mg concentration increases along thefirst direction D1 from the light emitting layer 30; and the Mgconcentration is the highest at the sixth portion P06. The third portionP03, which has a high increase rate of the Mg concentration, and thefifth portion P05, which has an increase rate that is lower than that ofthe third portion P03, are observed between the first portion P01 andthe sixth portion P06. However, the fourth portion P04 of thesemiconductor light emitting device 119 a, in which the increase rateagain becomes high, is not observed.

The maximum value of the Mg concentration is 4.4×10¹⁹ cm⁻³. Thiscorresponds to the maximum value of the Mg concentration of the secondp-side layer 22 being 4.4×10¹⁹ cm⁻³. The Mg concentration of the secondportion P02 is about 2.5×10¹⁹ cm⁻³. This corresponds to the Mgconcentration of the third p-side layer 23 being about 2.5×10¹⁹ cm⁻³.

On the other hand, the Al concentration increases along the firstdirection D1 from the light emitting layer 30 to reach the first Alvalue A01 which is the maximum value at the first position Z01.

The Mg concentration also increases along the first direction D1.However, the increase of the Mg concentration CMg is slower than theincrease of the Al concentration. For example, the Mg concentration (thefirst Mg value M01) at the second position Z02 is lower than that of thesemiconductor light emitting device 110. The first Mg value M01 of thesemiconductor light emitting device 119 a is 1.8×10¹⁸ cm⁻³.

Thus, in the semiconductor light emitting device 119 a, there is a delayin the Mg doping; and the Mg concentration reaches the Mg concentration(the maximum value) of 4.4×10¹⁹ cm⁻³ and continues toward 2.5×10¹⁹ cm⁻³which is the Mg concentration of the third p-side layer 23 without thefirst Mg value M01 reaching the Mg concentration of 2×10¹⁸ cm⁻³.

Thus, in the semiconductor light emitting device 119 a of the firstreference example, the maximum value of the Mg concentration of thesecond p-side layer 22 is low, i.e., 4.4×10¹⁹ cm⁻³; the first Mg valueM01 also is low; and the increase of the Mg concentration is slower thanthe increase of the Al concentration. Therefore, the Mg concentration ofthe second p-side layer 22 does not become sufficiently high. This isconsidered to be why the drive voltage of the semiconductor lightemitting device 119 a is higher than the drive voltage of thesemiconductor light emitting device 110.

As shown in FIG. 5, in the semiconductor light emitting device 119 b ofthe second reference example as well, the Mg concentration increasesalong the first direction D1 from the light emitting layer 30. However,a peak of the Mg concentration is not observed at the portioncorresponding to the second p-side layer 22.

The maximum value of the Mg concentration is 2.0×10¹⁹ cm⁻³. The Mgconcentration of the second portion P02 is about 2.5×10¹⁹ cm⁻³. The Mgconcentration (the first Mg value M01) at the second position Z02 is1.3×10¹⁸ cm⁻³.

In the semiconductor light emitting device 119 b as well, the increaseof the Mg concentration along the first direction D1 is relativelyabrupt at the vicinity of the interface between the second p-side layer22 and the light emitting layer 30. The Mg concentration rises abruptlyto reach 2×10¹⁹ cm⁻³, which is the target concentration of the firststage, at the vicinity of the interface. However, the Mg concentrationcontinues toward the concentration of the second p-side layer 22 withoutincreasing any higher.

Thus, in the semiconductor light emitting device 119 b of the secondreference example, the maximum value of the Mg concentration of thesecond p-side layer 22 is low. This is considered to be why the Mgconcentration of the second p-side layer 22 is insufficiently high andthe drive voltage is high.

Conversely, in the semiconductor light emitting device 110 according tothe embodiment as shown in FIG. 1, the Mg concentration increases tofollow the increase of the Al concentration. The Mg concentrationincreases without being slower than the increase of the Alconcentration. The first Mg value M01 at the second position Z02 ishigh, i.e., not less than 2×10¹⁸ cm⁻³. Thereby, the drive voltage can belower.

In the semiconductor light emitting device 110 as shown in FIG. 1, thefirst-direction position of the sixth portion P06 where the Mgconcentration is the highest is proximal to the first position Z01 inthe first direction where the Al concentration is the highest. The Mgconcentration increases without being slower than the increase of the Alconcentration corresponding to the second p-side layer 22.

When growing the semiconductor layers, the memory effect of the Mg thatis doped into the second p-side layer 22 is large. Adhesion of the Mgsupply to the inner walls of the crystal growth reactor, etc., occurduring the film formation; and it takes time for the source materialelement of the process gas to reach the front surface of the substrate50. Therefore, the delay of the doping occurs more easily for Mg thanfor Al. In the case where the doping of Mg is delayed, a region having alow Mg concentration (an undoped region) is formed at the vicinity ofthe interface between the light emitting layer 30 and the second p-sidelayer 22. This region is a high-resistance region. In the case where thehigh-resistance region forms, the drive voltage of the semiconductorlight emitting device is higher.

In the semiconductor light emitting device 110 as shown in FIG. 1, theMg concentration inside the second p-side layer rises abruptly from thevicinity of the interface between the light emitting layer 30 and thesecond p-side layer 22 to the target concentration of the first stage(e.g., not less than 2×10¹⁸ cm⁻³). In other words, the second p-sidelayer 22 substantially does not include an undoped region (ahigh-resistance region). Further, the maximum value of the Mgconcentration inside the second p-side layer 22 is high. The maximumvalue of the Mg concentration (the target value of the second stage) isnot less than about 1×10²⁰ cm⁻³.

In the embodiment, the formation of a region (a high-resistance region)having a low Mg concentration is suppressed by the Mg concentrationincreasing to follow the increase of the Al concentration without beingslower than the increase of the Al concentration. Therefore, asemiconductor light emitting device having a low drive voltage can beprovided.

In the case where the Al concentration of the second p-side layer 22 ishigh, it is difficult to the dope Mg at a high concentration.

In the embodiment, the peak wavelength of the light emitted from thelight emitting layer 30 is not less than 400 nm and not more than 650nm. In other words, the light emitted from the light emitting layer 30is not ultraviolet light. Therefore, the bandgap energy of the welllayer 32 is set to be small.

Therefore, the Al composition ratio x2 of Al_(x2)Ga_(1-x2)N used as thesecond p-side layer 22 that functions as the electron blocking layer isset to be relatively low, that is, not less than 0.05 and not more than0.2. Thus, in the embodiment, Mg can be introduced to the second p-sidelayer 22 at a high concentration because the Al composition ratio of thesecond p-side layer 22 is relatively low.

In the embodiment as shown in FIG. 1, the Mg concentration risesabruptly to follow the increase of the Al concentration without beingslower than the increase of the Al concentration and reaches the targetvalue of the first stage, e.g., not less than 2×10¹⁸ cm⁻³. The portionwhere the Mg concentration abruptly increases substantially correspondsto the third portion P03.

Subsequently, the increase rate of the Mg concentration is lower. Thisportion corresponds to the fifth portion P05. Then, the increase ratebecomes high again to reach the maximum value (not less than 1×10²⁰ cm⁻³and not more than 3×10²⁰ cm⁻³) which is the target value of the secondstage. This portion corresponds to the fourth portion P04. The drivevoltage can be lower by such a profile of the Mg concentration.

Thus, it is considered that the increase of the Mg concentrationincluding two abrupt increasing regions (the third portion P03 and thefourth portion P04) and a gradual increasing region (the fifth portionP05) between the two abrupt increasing regions is related to the changeof the Al concentration. Further, it is considered that this is relatedto the In concentration decreasing away from the light emitting layer30.

FIG. 6 is another graph showing the semiconductor light emitting deviceaccording to the first embodiment.

FIG. 7 and FIG. 8 are other graphs showing the semiconductor lightemitting devices of the reference examples.

In FIG. 6, FIG. 7, and FIG. 8, the profile of the In concentration isadded to the graphs shown in FIG. 1, FIG. 4, and FIG. 5, respectively.In these drawings, the vertical axis on the right is the Inconcentration (CIn having arbitrary units).

In the semiconductor light emitting device 110 as shown in FIG. 6, theIn concentration corresponding to the multiple well layers 32 is high.The In concentration of, for example, the third p-side layer 23 of thep-type semiconductor layer 20 is low.

A third position Z03 and a fourth position Z04 are set in the p-sideregion R1 to describe the profile of the In concentration.

The In concentration at the third position Z03 in the p-side region R1is taken as a first In value I01. The first In value I01 is the maximumvalue of the In concentration of the light emitting layer 30.

The fourth position Z04 is arranged with the third position Z03 alongthe first direction D1 in the region between the third position Z03 andthe position corresponding to the second portion P02. The third positionis a position along the first direction D1. The fourth position also isa position along the first direction D1. The In concentration at thefourth position Z04 is a second In value I02. The second In value I02 is1/10 of the first In value I01 (the maximum value).

In the semiconductor light emitting device 110 according to theembodiment, the Mg concentration (a second Mg value M02) at the fourthposition Z04 is not less than 3×10¹⁹ cm⁻³. It is favorable for the Mgconcentration (the second Mg value M02) at the fourth position Z04 to be8×10¹⁹ cm⁻³ or less. Specifically, in the semiconductor light emittingdevice 110 as shown in FIG. 6, the second Mg value M02 at the fourthposition Z04 is, for example, 3×10¹⁹ cm⁻³.

As shown in FIG. 6, the fourth position Z04 corresponds to the positionof the fifth portion P05. In other words, in the p-side region R1, theMg concentration increases relatively abruptly in the region where theIn concentration changes from the maximum value (the first In value I01)to the value (the second In value I02) of 1/10 of the maximum value.This region corresponds to the third portion P03. Then, when the Inconcentration is the second In value I02, the increase rate of the Mgconcentration is lower (the fifth portion P05). Then, the Mgconcentration increases abruptly again when the In concentration becomeslower than the second In value I02. This region corresponds to thefourth portion P04.

The Mg concentration can reach the maximum value that is not less than1×10²⁰ cm⁻³ and not more than 3×10²⁰ cm⁻³ by doping Mg at a highconcentration from the position where the In concentration becomes lessthan 1/10 of the maximum value.

In the embodiment, it is considered that the Mg concentration increasesabruptly in two stages in conjunction with the decrease of theconcentration of In by supplying a large supply amount of Cp₂Mg in themethod in which TMG, TMA, and Cp₂Mg are supplied in pulses whilesupplying a constant amount of NH₃.

In the semiconductor light emitting device 119 a which is the firstreference example as shown in FIG. 7, the second Mg value M02 at thefourth position Z04 is 2.5×10¹⁹ cm⁻³. In the first reference example,the second Mg value M02 is lower than the value of the semiconductorlight emitting device 110.

In the semiconductor light emitting device 119 b which is the secondreference example as shown in FIG. 8, the second Mg value M02 at thefourth position Z04 is 1.8×10¹⁹ cm⁻³. In the second reference example aswell, the second Mg value M02 is lower than the value of thesemiconductor light emitting device 110.

A low drive voltage can be realized by the Mg concentration (the secondMg value M02) at the fourth position Z04 being not less than 3×10¹⁹cm⁻³.

As shown in FIG. 6, the Mg concentration of the fifth portion P05 is,for example, not less than 1.0×10¹⁹ cm⁻³ and not more than 3×10¹⁹ cm⁻³.The Mg concentration of the fifth portion P05 can be set to berelatively high. In the embodiment, the Mg concentration increases fromthe second p-side layer 22 toward the third p-side layer 23. Therefore,smooth carrier injection is achieved. Thereby, the drive voltage can belower.

There are examples where C (carbon) is doped together with Mg tosuppress the formation of an undoped Mg region. In the semiconductorlight emitting device 110, the concentration of C (carbon) in the p-sideregion R1 is, for example, not more than 5×10¹⁸ cm⁻³. That is, in thesemiconductor light emitting device 110, C (carbon) substantially is notdoped. In the semiconductor light emitting device 110, the formation ofa region of the p-type semiconductor layer 20 having a low Mgconcentration can be suppressed without doping with C (carbon).

In the semiconductor light emitting device 110, the length (thethickness) of the fifth portion P05 along the first direction D1 isshorter than the length (the thickness) of the third portion P03 alongthe first direction D1. The length (the thickness) of the fifth portionP05 along the first direction D1 is shorter than the length (thethickness) of the fourth portion P04 along the first direction D1. Thelower drive voltage is obtained more effectively by reducing thethickness of the fifth portion P05 which has the low increase rate ofthe Mg concentration.

The length (the thickness) of the third portion P03 along the firstdirection D1 is, for example, not less than 5 nm and not more than 30nm. The length (the thickness) of the fourth portion P04 along the firstdirection D1 is, for example, not less than 5 nm and not more than 30nm. The length (the thickness) of the fifth portion P05 along the firstdirection D1 is, for example, not less than 3 nm and not more than 20nm.

The distance along the first direction between the first position Z01(the position where the Al concentration becomes the first Al value A01which is the maximum value) and the second position Z02 (the positionwhere the Al concentration becomes the second Al value A02 which is1/100 of the first Al value A01) is, for example, not less than 5 nm andnot more than 30 nm. In the case where the distance is too short, itbecomes difficult for the increase of the Mg concentration to follow theincrease of the Al concentration. In the case where the distance is toolong, for example, the crystallinity degrades easily. Also, there arecases where the electron blocking properties degrade and the luminousefficiency decreases.

In the embodiment, for example, the second position Z02 is positionedinside the third portion P03. The second position Z02 may be positionedinside the fifth portion P05. The second position Z02 may be positionedinside the fourth portion P04.

FIG. 9 is a graph showing another semiconductor light emitting deviceaccording to the first embodiment.

FIG. 9 shows the profile (CMg) of the Mg concentration, the profile(CAl) of the Al concentration, and the profile (CIn of the Inconcentration of the semiconductor light emitting device 111 accordingto the embodiment. In the semiconductor light emitting device 111, thethickness of the second p-side layer 22 is 15 nm. The configuration andformation methods of the semiconductor light emitting device 111 are thesame as those of the semiconductor light emitting device 110.

As shown in FIG. 9, the first to seventh portions P01 to P07 areprovided in the semiconductor light emitting device 111 as well. Also,similarly to the description regarding the semiconductor light emittingdevice 110, the first to fourth positions Z01 to Z04 are set.

In the semiconductor light emitting device 111 as well, the Mgconcentration increases to follow the increase of the Al concentrationin the p-side region R1. The Mg concentration (the first Mg value M01)at the second position Z02 is 4.5×10¹⁸ cm⁻³. The Mg concentration of thesixth portion P06 of the second p-side layer 22 is 2.3×10²⁰ cm⁻³. The Mgconcentration (the second Mg value M02) at the fourth position Z04 is3.9×10¹⁹ cm⁻³.

In the semiconductor light emitting device 111 as well, the drivevoltage can be lower.

FIG. 10 is a graph showing a semiconductor light emitting device of areference example.

FIG. 10 shows the profile (CMg) of the Mg concentration, the profile(CAl) of the Al concentration, and the profile (CIn) of the Inconcentration of the semiconductor light emitting device 119 c of thethird reference example. In the semiconductor light emitting device 119c as well, the thickness of the second p-side layer 22 is 15 nm. Otherthan the thickness of the second p-side layer 22 being 15 nm, thesemiconductor light emitting device 119 c is formed by a method that issimilar to that of the semiconductor light emitting device 119 a of thefirst reference example.

In the semiconductor light emitting device 119 c of the third referenceexample, the increase of the Mg concentration is slower than theincrease of the Al concentration. In the semiconductor light emittingdevice 119 c, the Mg concentration (the first Mg value M01) at thesecond position Z02 is 3.8×10¹⁷ cm⁻³. The maximum value of the Mgconcentration of the second p-side layer 22 is 1.8×10²⁰ cm⁻³. The Mgconcentration (the second Mg value M02) at the fourth position Z04 is2.8×10¹⁹ cm⁻³. The drive voltage of the semiconductor light emittingdevice 119 c is higher than that of the semiconductor light emittingdevice 111.

For a high current density region, the device characteristics of thesemiconductor light emitting device 111 are better than those of thesemiconductor light emitting device 119 c.

Second Embodiment

The embodiment relates to a method for manufacturing the semiconductorlight emitting device. For example, the method for manufacturing thesemiconductor light emitting device 110 described above, etc., areapplicable as the manufacturing method.

FIG. 11 is a flowchart showing the method for manufacturing thesemiconductor light emitting device according to the second embodiment.

The method for manufacturing the semiconductor light emitting deviceaccording to the embodiment includes a process (step S110) of formingthe light emitting layer 30 that includes a nitride semiconductor on then-type semiconductor layer 10 that includes a nitride semiconductor.

The manufacturing method further includes a process (step S120) offorming a first film (the second p-side layer 22) of Al_(x)Ga_(1-x)N(0.05≦x≦0.2) including Mg on the light emitting layer 30.

The manufacturing method further includes a process (step S130) offorming a second film (the third p-side layer 23) including a nitridesemiconductor including Mg on the first film.

The manufacturing method further includes a process (step S140) offorming a third film (the first p-side layer 21) including a nitridesemiconductor including Mg on the second film.

In the process (step S120) of forming the first film, the first process(step S121) and the second process (step S122) are multiply repeatedalternately. In the first process, a group V source-material gas, a gasincluding Ga, a gas including Al, and a gas including Mg are supplied.In the second process, a group V source-material gas is supplied withoutsupplying the gas including gallium recited above, the gas including Alrecited above, and the gas including Mg recited above.

For example, NH₃ is used as the group V source-material gas. Forexample, at least one selected from TMG and TEG is used as the gasincluding Ga. For example, TMA is used as the gas including Al. Forexample, Cp₂Mg is used as the gas including Mg.

In the manufacturing method as shown in FIG. 1, FIG. 6, and FIG. 9, themaximum value of the concentration of the Mg in the p-side region R1that includes the light emitting layer 30, the first film (the secondp-side layer 22), and the second film (the third p-side layer 23) is notless than 1×10²⁰ cm⁻³ and not more than 3×10²⁰ cm⁻³.

The Al concentration has a maximum value at the first position Z01 inthe p-side region R1. The second position Z02 is arranged with the firstposition Z01 along the first direction D1 from the light emitting layer30 toward the first film (the second p-side layer 22) in the regionbetween the first position Z01 and the position corresponding to thelight emitting layer 30. The Al concentration at the second position Z02is 1/100 of the maximum value. The Mg concentration at the secondposition Z02 is not less than 2×10¹⁸ cm⁻³.

According to the manufacturing method according to the embodiment, amethod for manufacturing a semiconductor light emitting device having alow drive voltage can be provided.

In the manufacturing method, the concentration profile of Mg in thep-side region R1 may include the first to seventh portions P01 to P07.

The second portion P02 is provided between the first portion P01 and thethird film (the first p-side layer 21). The third portion P03 isprovided between the first portion P01 and the second portion P02. TheMg concentration of the third portion P03 increases at the firstincrease rate along the first direction D1.

The fourth portion P04 is provided between the third portion P03 and thesecond portion P02. The Mg concentration of the fourth portion P04increases at the second increase rate along the first direction D1.

The fifth portion P05 is provided between the third portion P03 and thefourth portion P04. The Mg concentration of the fifth portion P05increases at the third increase rate along the first direction D1. Thethird increase rate is lower than the first increase rate and lower thanthe second increase rate.

The sixth portion P06 is provided between the fourth portion P04 and thesecond portion P02. The Mg concentration of the sixth portion P06 is notless than 1×10²⁰ cm⁻³ and not more than 3×10²⁰ cm⁻³ and is higher thanthe concentrations of Mg of the first portion P01, the second portionP02, the third portion P03, the fourth portion P04, and the fifthportion P05.

The seventh portion P07 is provided between the sixth portion P06 andthe second portion P02. The Mg concentration of the seventh portion P07decreases along the first direction D1.

In the manufacturing method, the concentration of C (carbon) in thep-side region R1 is not more than 5×10¹⁸ cm⁻³.

According to the embodiments, a semiconductor light emitting devicehaving a low drive voltage and a method for manufacturing thesemiconductor light emitting device can be provided.

In the specification, “nitride semiconductor” includes all compositionsof semiconductors of the chemical formula B_(x)In_(y)Al_(z)Ga_(1-x-y-z)N(0≦x≦1, 0≦y≦1, 0≦z≦1, and x+y+z≦1) for which the composition ratios x,y, and z are changed within the ranges respectively. “Nitridesemiconductor” further includes group V elements other than N (nitrogen)in the chemical formula recited above, various elements added to controlvarious properties such as the conductivity type and the like, andvarious elements included unintentionally.

In this specification, “perpendicular” and “parallel” are not alwaysexactly perpendicular and parallel and include, for example, variationin the manufacturing process.

In the above, embodiments of the invention have been described withreference to specific examples, however the invention is not limited tothese specific examples. For example, specific configurations of variouscomponents used in light emitting device such as the substrate, thebuffer layer, the foundation layer, the semiconductor layer, theintermediate layer, the light emitting layer and the electrode or thelike that are suitably selected from the publicly known ones by thoseskilled in the art are encompassed within the scope of the invention aslong as the configurations can implement the invention similarly andachieve the same effects.

Components in two or more of the specific examples can be combined witheach other as long as technically feasible, and such combinations arealso encompassed within the scope of the invention as long as they fallwithin the spirit of the invention.

The light emitting device and a method for manufacturing the samedescribed above as the embodiments of the invention can be suitablymodified and practiced by those skilled in the art, and suchmodifications are also encompassed within the scope of the invention aslong as they fall within the spirit of the invention.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel devices and methods describedherein may be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the devices andmethods described herein may be made without departing from the spiritof the inventions. The accompanying claims and their equivalents areintended to cover such forms or modifications as would fall within thescope and spirit of the invention.

1. A method for manufacturing a semiconductor light emitting device,comprising: forming a light emitting layer including a nitridesemiconductor on an n-type semiconductor layer including a nitridesemiconductor; forming a first film of Al_(x)Ga_(1-x)N (0.05≦x≦0.2) onthe light emitting layer, the first film including Mg; forming a secondfilm including a nitride semiconductor including Mg on the first film;and forming a third film including a nitride semiconductor including Mgon the second film, the forming of the first film including alternatelyand multiply repeating: a first process of supplying a group Vsource-material gas, a gas including Ga, a gas including Al, and a gasincluding Mg; and a second process of supplying the group Vsource-material gas without supplying the gas including Ga, the gasincluding Al, and the gas including Mg, a maximum value of aconcentration of Mg in a p-side region including the light emittinglayer, the first film, and the second film being not less than 1×10²⁰cm⁻³ and not more than 3×10²⁰ cm⁻³, an Al concentration in the p-sideregion having a maximum value at a first position, the Al concentrationbeing 1/100 of the maximum value at a second position arranged with thefirst position along a first direction from the light emitting layertoward the first film in a region between the first position and aposition corresponding to the light emitting layer, a Mg concentrationat the second position being not less than 2×10¹⁸ cm ⁻³ .
 2. The methodaccording to claim 1, wherein a concentration profile of Mg in thep-side region includes: a first portion; a second portion providedbetween the first portion and the third film; a third portion providedbetween the first portion and the second portion, a Mg concentration ofthe third portion increasing at a first increase rate along the firstdirection; a fourth portion provided between the third portion and thesecond portion, a Mg concentration of the fourth portion increasing at asecond increase rate along the first direction; a fifth portion providedbetween the third portion and the fourth portion, a Mg concentration ofthe fifth portion increasing at a third increase rate along the firstdirection, the third increase rate being lower than the first increaserate and lower than the second increase rate; a sixth portion providedbetween the fourth portion and the second portion, a Mg concentration ofthe sixth portion being not less than 1×10²⁰ cm⁻³ and not more than3×10²⁰ cm⁻³ and being higher than the concentrations of Mg of the firstportion, the second portion, the third portion, the fourth portion, andthe fifth portion; and a seventh portion provided between the sixthportion and the second portion, a Mg concentration of the seventhportion decreasing along the first direction.
 3. The method according toclaim 1, wherein a concentration of C (carbon) in the p-side region isnot more than 5×10¹⁸ cm⁻³.
 4. The method according to claim 2, whereinthe Mg concentration at the second position is not more than 1.2×10¹⁹cm⁻³.
 5. The method according to claim 2, wherein the Mg concentrationof the fifth portion is not less than 1×10¹⁹ cm⁻³ and not more than3×10¹⁹ cm⁻³.
 6. The method according to claim 2, wherein a concentrationof C (carbon) in the p-side region is not more than 5×10¹⁸ cm⁻³.
 7. Themethod according to claim 2, wherein a length of the fifth portion alongthe first direction is shorter than a length of the third portion alongthe first direction and shorter than a length of the fourth portionalong the first direction.
 8. The method according to claim 2, wherein alength of the third portion along the first direction is not less than 5nm and not more than 30 nm.
 9. The method according to claim 2, whereina length of the fourth portion along the first direction is not lessthan 5 nm and not more than 30 nm.
 10. The method according to claim 2,wherein a length of the fifth portion along the first direction is notless than 3 nm and not more than 20 nm.
 11. The method according toclaim 2, wherein a distance along the first direction between the firstposition and the second position is not less than 5 nm and not more than30 nm.
 12. The method according to claim 2, wherein the Mg concentrationat the fourth position is not more than 8×10¹⁹ cm⁻³.
 13. The methodaccording to claim 2, wherein the second position is positioned insidethe third portion.
 14. The method according to claim 2, wherein thesecond position is positioned inside the fifth portion.
 15. The methodaccording to claim 2, wherein the second position is positioned insidethe fourth portion.
 16. The method according to claim 2, wherein thegroup V source-material gas includes NH₃, the gas including Ga includesat least one of tri-methyl gallium and tri-ethyl gallium, the gasincluding Al includes tri-methyl aluminum, and the gas including Mgincludes bis(cyclopentadienyl) magnesium.